This system was developed to reverse-engineer the electronic interface for a thermal inkjet print head. All of the addressing logic, drive transistors, temperature sensors, microfluidics and heaters for the 7860 nozzles are fabricated on the same silicon substrate.
This system was developed to reverse-engineer the electronic interface for a thermal inkjet print head. All of the addressing logic, drive transistors, temperature sensors, microfluidics and heaters for the 7860 nozzles are fabricated on the same silicon substrate.
